The Ministry of Education has extended the deadline for applying for Higher Education Loans and scholarships by one month, to October 7, 2023.
Education CS Ezekiel Machogu said in a statement to the media on Tuesday that the extension will allow 112,468 students who have yet to apply for the loans to do so.
He stated that as of September 5, 156,532 students had applied for both University Fund scholarships and High Education Loans Board loans, accounting for only 60% of students placed by Kenya Universities and Colleges Central Placement Service (KUCCPS) based on KCSE 2022 performance.
To make the application process easier, the government has waived the requirement for a National ID for students under the age of 18.
“The Ministry has accordingly directed the Higher Education Loan Board (HELB) to review its portal to ensure all the 2,000 students yet to attain the age of 18 to apply for HELB loans,” CS Machogu said.
“The Universities Fund and Higher Education Loans Board have been directed to put in place measures to commence immediate and speedy processing of scholarships and bursaries for all students who have already applied. Thereafter, the agencies will ensure the processing and disbursement exercise of scholarships and loans is conducted on a continuing basis”
At the same time, the Education Ministry has directed institutions to give First Year students enough time to report to school so that no students are locked out.
“Where universities have already commenced admission of First Years, measures must be in place to ensure students are not turned away for failure to pay school fees as the Government processes their funds applications,” Machogu added.
Universities Fund and the Higher Education Loans Board will also be required to deploy personnel at all Huduma centers to assist students who may require help with the application process.
According to CS Machogu, no student will miss school due to a lack of fees. He stated that those classified as vulnerable and extremely needy will receive full government funding through scholarships.
